UCPSS 2008

September 21 to 24 | 2008

Ninth International Symposium on

ULTRA CLEAN PROCESSING OF SEMICONDUCTOR SURFACES

UCPSS 2008 Participants
(click on the photo to download the file - 10Mb)

Download the UCPSS 2008 Abstract Book (52,1 Mb)
Click here (only for registered participants - password protected)

Tutorials (September 21)

• Prof. Jakub Nalaskowski (IBM): Particle - surface interactions in semiconductor cleaning
• Dr. D. Martin Knotter( NXP Semiconductors): Ozonized water is green
• Dr. Joel Barnett (Sematech): Cleaning and etching of advance gate stacks
• Dr. Martin M. Frank (IBM): High-mobility channels: fundamentals of surface preparation
• Dr. Guy Vereecke (IMEC): Post-etch wet residue removal in Cu/low-k integration
• Dr. Bart Swinnen (IMEC): Stacking and interconnection of ICs in the 3rd dimension

Conference (September 22-24)

The Symposium on Ultra Clean Processing of Semiconductor Surfaces (UCPSS) is a biannual event. The last edition was held on September 22-24, 2008 in the Oud Sint-Jan, conference center in Brugge. It is the purpose of the UCPSS-symposium to increase the level of understanding on ultra-clean processing technology in all steps of the IC-production. The conference consists of invited presentations as well as selected contributing presentations and posters. The issues addressed included the following topics:

•   surface conditioning for sensitive processes (e.g. high-k dielectrics, Ge surfaces)
•   chemical and physical cleaning in liquid, gaseous and supercritical ambient
•    trade-offs between cleaning performance, substrate damage and etching
•    application-specific cleans (e.g. epitaxy, SiGe, CVD, wafer backside)
•    cleaning and surface treatments at the interconnect level, cleaning of low-k material, post-CMP    cleaning
•    dry-etch resist strip and polymer removal
•    contamination/particle control and its relation with process performance
•    controlled environment during processing, equipment for wafer cleaning
•    surface chemistry, passivation, and characterization of Si, Ge, and GaAs
•    effects of Si-wafer defects and Si-surface topography on process yield
•    process and contamination diagnostics, in-situ monitoring and process control
•    general issues in ultra-clean technology, ultra-pure materials and supply systems
•    environmentally friendly technologies and mass balance equations

Invited speakers:

• Dr. Willy Rachmady (Intel Corp.): Surface Preparation and Passivation of III-V Substrates for Ultra-High Speed, Low Power Logic Applications
• Dr. Brian Kirkpatrick (Texas Instruments): Material Loss Impact on Device Performance for 32nm CMOS and Beyond
  
• Dr. Ayako Shimazaki (Toshiba Corp.): Metallic contamination control in leading-edge ULSI Manufacturing
  
• Prof. Dennis Hess (Georgia Tech): Photoresist Removal Using Alternative Chemistries and Pressures
  
• Dr. Lucille Broussous (STMicroelectronics): Porous low-k wet etch in HF-based solutions: focus on cleaning process window, "pore-sealing" and "k recovery"
  

Major sponsors

Contributors

If you want to receive further information on the tutorial and conference,
please contact the conference secretariat:
UCPSS – Momentum
Grensstraat 8, B-3010 Leuven, Belgium
 Tel +32 (0)16 40 45 55 - fax +32 (0)16 40 35 51
ucpss@momentum-pco.be